Home News

News

  • How to Assembly the through Hole
    01.07.2018 Industry News
    A thru-hole component is described as a component leaded with a wire or a metallic lead that is mounted to the board by placing the lead though plated holes in the board and then soldered.Figure 3-2. Applying heat evenly to the lead and the......
  • What are SMT components?
    26.10.2015 Industry News
    What are SMT components?Surface mount devices, SMDs by their nature are very different to the traditional leaded components. They can be split into a number of categories:Passive SMDs:   There is quite a variety of different packa......
  • PCB BGA
    26.10.2015 Industry News
    PCB BGAA ball grid array (BGA) is a type of surface-mount packaging used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a d......
  • Part of the company parts
    26.10.2015 Company News
    Laser Plotter Inner Layer DES Line Automated Optical Inspector (AOI) Lamination MachineDrilling MachinesPTH & Panel Plating Collimated ExposureENIG Line Flying Probe E-Testers Universal E-Testers......
  • How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
    26.10.2015 Industry News
    How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow ProcessSolder joint voiding is a phenomenon that causes empty spaces or voids to occur within the joint. Solder joint voiding often occurs on BGAs and larger ......